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Multi-arc high purity Nickel target 99.99% - Nickel201 target-Nickel 201 sputtering target.Nickel Copper Target for pvd Coating Semiconductor use

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Multi-arc high purity Nickel target 99.99% - Nickel201 target-Nickel 201 sputtering target.Nickel Copper Target for pvd Coating Semiconductor use

We are nickel targets supplier  Our nickel price is very competitive.We can offer a wide range of nickel products, such as UNS N02200 (Ni 200)UNS N02201 (Ni 201)N4 N6 N5,Nickel products are available in various size range.

    PROBLEM TO BE SOLVED: To provide a method for manufacturing a high-purity nickel target for magnetron sputtering which gives the film satisfactory thickness uniformity and plasma a satisfactory ignition property, even in a manufacturing process for a 300 mm wafer, and to provide a high-purity nickel target.;SOLUTION: The method for manufacturing the high-purity nickel target for magnetron sputtering with superior film thickness uniformity comprises steps of hot-forging the high-purity nickel, then cold-rolling it at a rolling reduction of 30% or higher, and further heat-treating it at 250°C or a higher temperature; and repeating the above cold-rolling and heat treatment at least twice.

    • Nickel 201 sputtering target (1)r63
      • The thin film which was formed production manner of the high purity nickel, with the sputtering target and the said sputtering target which consist of the high purity nickel and the same high purity nickel.
      01
    • Nickel 201 sputtering target (2)bse
      • Upon performing electrolysis with a solution containing nickel as the electrolytic solution, anolyte is adjusted to pH 2 to 5; impurities such as iron, cobalt and copper contained in the anolyte are eliminated by combining any one or two or more of the methods among adding an oxidizing agent and precipitating and eliminating the impurities as hydroxide, eliminating the impurities through preliminary electrolysis, or adding Ni foil and eliminating the impurities through displacement reaction;
      02
    • Nickel 201 sputtering target (4)h0i
      • impurities are thereafter further eliminated with a filter; and the impurity-free solution is employed as catholyte to perform the electrolysis. The present invention relates to a simple method of performing electrolytic refining employing a solution containing nickel from nickel raw material containing a substantial amount of impurities, and provides technology on efficiently manufacturing high purity nickel having a purity of 5N (99.999 wt %) or more
      03
    • Nickel 201 sputtering target (3)ozs
      • Purity 5N (99.999wt%) the technology which produces the high purity nickel above efficiently is offered in regard to the simple manner which it electrolyzes refines from the nickel raw materials where the impurity is contained mainly, making use of the nickel content solution
      04

    As the electrolyte of, after removing the impurity whether the occasion where it electrolyzes making use of the nickel content solution, you adjust anoraito pH2 - 5, inserting the oxidizer, it settles you remove impurity such as iron, cobalt and the copper which are contained in anoraito, the said impurity as hydroxide, or you remove the said impurity or with preliminary electrolysis, or insert the Ni foil and you remove the said impurity with the displacement reaction in each case by combining or more the manner of 1 or 2, furthermore using the filter, it removes the impurity, using the liquid after the removing as kasoraitoIt does and electrolyzes.

    Grade

    Surface

    Forms

    Specification

    Pure nickel Ni-Cr alloy Ni-V alloy

    Precisely machined / ground, shinny bright surface Roughness Ra 1.6, 0.8

    Circular / planar / tubular Custom-made form as per drawing

    As per general industry standard or customer’s specific demand

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    Other products can be provided based on customer’s requirements

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