Titanium
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Titanium target TA1 TA2 Special for vacuum PVD Coating Electroplating Sputtering Target
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- titanium sputtering target is a material used in the process of physical vapor deposition (PVD) to deposit thin films of titanium onto a substrate. The sputtering target is typically made of high-purity titanium and is bombarded with high-energy ions in a vacuum chamber, causing atoms to be ejected from the target and deposited onto the substrate, creating a thin film.
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- These thin films of titanium have a wide range of applications, including in the semiconductor industry for integrated circuits, in the production of solar cells, and in the manufacturing of decorative coatings and hard-wearing surfaces. The use of titanium sputtering targets allows for precise control over the thickness and properties of the deposited titanium film, making it a valuable tool in various industries.
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- Purity is one of the main properties of the titanium target, because the purity of the target has a great effect on the properties of the film. In addition, density is also one of the key performance indicators of target materials. In order to reduce the porosity in the target solids and improve the properties of the sputtering film, the titanium target is usually required to have a higher density. The higher the density of the target, the better the performance of the film.
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Name |
Titanium target |
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Grade |
Commercially pure (Grade 1, Grade 2), Ti-6Al-4V (Grade 5), Ti-Al alloy, Ti-Cr alloy, Ti-Ni alloy, Ti-Si alloy, Ti-Zr alloy |
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Titanium target surface |
Precisely machined / ground, shinny bright surface |
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Titanium target forms |
Circular / planar / tubular (Custom-made form as per drawing) |
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Purity |
Above 99.99% |
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Primarily used specification for titanium sputtering target |
As per general industry standard or customer’s specific demand |
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